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PBSS304NX
60 V, 4.7 A NPN low VCEsat (BISS) transistor
Rev. 02 -- 20 November 2009 Product data sheet
1. Product profile
1.1 General description
NPN low VCEsat Breakthrough In Small Signal (BISS) transistor in a SOT89 (SC-62/TO-243) small and flat lead Surface-Mounted Device (SMD) plastic package. PNP complement: PBSS304PX.
1.2 Features
Low collector-emitter saturation voltage VCEsat High collector current capability IC and ICM High collector current gain (hFE) at high IC High efficiency due to less heat generation Smaller required Printed-Circuit Board (PCB) area than for conventional transistors
1.3 Applications
High-voltage DC-to-DC conversion High-voltage MOSFET gate driving High-voltage motor control High-voltage power switches (e.g. motors, fans) Automotive applications
1.4 Quick reference data
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Table 1. Symbol VCEO IC ICM RCEsat
[1]
Quick reference data Parameter collector-emitter voltage collector current peak collector current collector-emitter saturation resistance single pulse; tp 1 ms IC = 4 A; IB = 200 mA
[1]
Conditions open base
Min -
Typ 37
Max 60 4.7 9.4 53
Unit V A A m
Pulse test: tp 300 s; 0.02.
NXP Semiconductors
PBSS304NX
60 V, 4.7 A NPN low VCEsat (BISS) transistor
2. Pinning information
Table 2. Pin 1 2 3 Pinning Description emitter collector base
3 2 1
3 1
sym042
Simplified outline
Symbol
2
3. Ordering information
Table 3. Ordering information Package Name PBSS304NX SC-62 Description plastic surface-mounted package; collector pad for good heat transfer; 3 leads Version SOT89 Type number
4. Marking
Table 4. Marking codes Marking code[1] *5E Type number PBSS304NX
[1] * = -: made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia
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* = W: made in China
PBSS304NX_2
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 -- 20 November 2009
2 of 15
NXP Semiconductors
PBSS304NX
60 V, 4.7 A NPN low VCEsat (BISS) transistor
5. Limiting values
Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VCBO VCEO VEBO IC ICM Ptot Parameter collector-base voltage collector-emitter voltage emitter-base voltage collector current peak collector current total power dissipation single pulse; tp 1 ms Tamb 25 C
[1] [2] [3]
Conditions open emitter open base open collector
Min -65 -65
Max 60 60 5 4.7 9.4 0.6 1.65 2.1 150 +150 +150
Unit V V V A A W W W C C C
Tj Tamb Tstg
[1] [2] [3]
junction temperature ambient temperature storage temperature
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm2. Device mounted on a ceramic PCB, Al2O3, standard footprint.
2.5 Ptot (W) 2.0
(2) (1)
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1.5
1.0
(3)
0.5
0 -75
-25
25
75
125 175 Tamb (C)
(1) Ceramic PCB, Al2O3, standard footprint (2) FR4 PCB, mounting pad for collector 6 cm2 (3) FR4 PCB, standard footprint
Fig 1.
Power derating curves
PBSS304NX_2
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 -- 20 November 2009
3 of 15
NXP Semiconductors
PBSS304NX
60 V, 4.7 A NPN low VCEsat (BISS) transistor
6. Thermal characteristics
Table 6. Symbol Rth(j-a) Thermal characteristics Parameter thermal resistance from junction to ambient Conditions in free air
[1] [2] [3]
Min -
Typ -
Max 208 76 60 20
Unit K/W K/W K/W K/W
Rth(j-sp)
[1] [2] [3]
thermal resistance from junction to solder point
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm2. Device mounted on a ceramic PCB, Al2O3, standard footprint.
103 Zth(j-a) (K/W) 102
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=1 0.75 0.50 0.33 0.20 0.10
10
0.05 0.02 0.01 0
1 10-5
10-4
10-3
10-2
10-1
1
10
102 tp (s)
103
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FR4 PCB, standard footprint
Fig 2.
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
PBSS304NX_2
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 -- 20 November 2009
4 of 15
NXP Semiconductors
PBSS304NX
60 V, 4.7 A NPN low VCEsat (BISS) transistor
102 Zth(j-a) (K/W) 10
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=1 0.75 0.50 0.20 0.10 0.05 0.02 0.01 0.33
1 0
10-1 10-5
10-4
10-3
10-2
10-1
1
10
102 tp (s)
103
FR4 PCB, mounting pad for collector 6 cm2
Fig 3.
102
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
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=1 Zth(j-a) (K/W) 10 0.10 0.05 0.02 1 0.01 0.75 0.50 0.20 0.33
0 www..com
10-1 10-5
10-4
10-3
10-2
10-1
1
10
102 tp (s)
103
Ceramic PCB, Al2O3, standard footprint
Fig 4.
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
PBSS304NX_2
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 -- 20 November 2009
5 of 15
NXP Semiconductors
PBSS304NX
60 V, 4.7 A NPN low VCEsat (BISS) transistor
7. Characteristics
Table 7. Characteristics Tamb = 25 C unless otherwise specified. Symbol ICBO Parameter collector-base cut-off current emitter-base cut-off current DC current gain Conditions VCB = 60 V; IE = 0 A VCB = 60 V; IE = 0 A; Tj = 150 C VEB = 5 V; IC = 0 A VCE = 2 V; IC = 0.5 A VCE = 2 V; IC = 1 A VCE = 2 V; IC = 2 A VCE = 2 V; IC = 4 A VCE = 2 V; IC = 6 A VCEsat collector-emitter saturation voltage IC = 0.5 A; IB = 50 mA IC = 1 A; IB = 50 mA IC = 1 A; IB = 10 mA IC = 2 A; IB = 40 mA IC = 4 A; IB = 200 mA IC = 4 A; IB = 400 mA IC = 4 A; IB = 80 mA IC = 4.7 A; IB = 235 mA RCEsat VBEsat
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[1] [1] [1] [1] [1] [1] [1] [1] [1] [1] [1] [1] [1] [1] [1] [1] [1] [1]
Min 300 300 250 150 75 -
Typ 520 500 470 250 115 25 50 85 105 145 140 190 170 37 48 0.82 0.94 0.75 15 95 110 360 195 555 130 48
Max 100 50 100 35 70 120 150 210 200 290 245 53 73 0.9 1.05 0.85 70
Unit nA A nA
IEBO hFE
mV mV mV mV mV mV mV mV m m V V V ns ns ns ns ns ns MHz pF
collector-emitter saturation resistance
IC = 4 A; IB = 200 mA IC = 4 A; IB = 80 mA
base-emitter saturation IC = 1 A; IB = 100 mA voltage IC = 4 A; IB = 400 mA base-emitter turn-on voltage delay time rise time turn-on time storage time fall time turn-off time transition frequency collector capacitance VCE = 10 V; IC = 100 mA; f = 100 MHz VCB = 10 V; IE = ie = 0 A; f = 1 MHz VCE = 2 V; IC = 2 A VCC = 12.5 V; IC = 3 A; IBon = 0.15 A; IBoff = -0.15 A
VBEon td tr ton ts tf toff fT Cc
[1]
-
Pulse test: tp 300 s; 0.02.
PBSS304NX_2
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 -- 20 November 2009
6 of 15
NXP Semiconductors
PBSS304NX
60 V, 4.7 A NPN low VCEsat (BISS) transistor
1000 hFE 800
(1)
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14 IC (A) 12 10
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IB (mA) = 250 225 200 175 150 125 100 75 50 25
600
(2)
8 6
400
(3)
4 200 2 0 10-1 0 0 1 2 3 4 VCE (V) 5
1
10
102
103 104 IC (mA)
VCE = 2 V (1) Tamb = 100 C (2) Tamb = 25 C (3) Tamb = -55 C
Tamb = 25 C
Fig 5.
DC current gain as a function of collector current; typical values
1.2
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Fig 6.
Collector current as a function of collector-emitter voltage; typical values
1.2
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VBE (V) 0.8
(1)
VBEsat (V) 0.8
(1)
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(2)
(2)
0.4
(3)
0.4
(3)
0 10-1
1
10
102
103 104 IC (mA)
0 10-1
1
10
102
103 104 IC (mA)
VCE = 2 V (1) Tamb = -55 C (2) Tamb = 25 C (3) Tamb = 100 C
IC/IB = 20 (1) Tamb = -55 C (2) Tamb = 25 C (3) Tamb = 100 C
Fig 7.
Base-emitter voltage as a function of collector current; typical values
Fig 8.
Base-emitter saturation voltage as a function of collector current; typical values
PBSS304NX_2
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 -- 20 November 2009
7 of 15
NXP Semiconductors
PBSS304NX
60 V, 4.7 A NPN low VCEsat (BISS) transistor
1 VCEsat (V) 10-1
(1) (2) (3)
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1 VCEsat (V) 10-1
(1) (2)
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10-2
10-2
(3)
10-3 10-1
1
10
102
103 104 IC (mA)
10-3 10-1
1
10
102
103 104 IC (mA)
IC/IB = 20 (1) Tamb = 100 C (2) Tamb = 25 C (3) Tamb = -55 C
Tamb = 25 C (1) IC/IB = 100 (2) IC/IB = 50 (3) IC/IB = 10
Fig 9.
Collector-emitter saturation voltage as a function of collector current; typical values
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Fig 10. Collector-emitter saturation voltage as a function of collector current; typical values
103 RCEsat () 102
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102 RCEsat () 10
10
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1 10-1
(1) (2) (3) (1) (2) (3)
10-1
10-2 10-1
1
10
102
103 104 IC (mA)
10-2 10-1
1
10
102
103 104 IC (mA)
IC/IB = 20 (1) Tamb = 100 C (2) Tamb = 25 C (3) Tamb = -55 C
Tamb = 25 C (1) IC/IB = 100 (2) IC/IB = 50 (3) IC/IB = 10
Fig 11. Collector-emitter saturation resistance as a function of collector current; typical values
Fig 12. Collector-emitter saturation resistance as a function of collector current; typical values
PBSS304NX_2
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 -- 20 November 2009
8 of 15
NXP Semiconductors
PBSS304NX
60 V, 4.7 A NPN low VCEsat (BISS) transistor
8. Test information
IB 90 % input pulse (idealized waveform) IBon (100 %)
10 %
IBoff
IC 90 %
output pulse (idealized waveform)
IC (100 %)
10 % t td ton tr ts toff tf
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Fig 13. BISS transistor switching time definition
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VBB VCC
RB (probe) oscilloscope 450 VI R1 R2
RC Vo (probe) 450 DUT oscilloscope
mlb826
VCC = 12.5 V; IC = 3 A; IBon = 0.15 A; IBoff = -0.15 A
Fig 14. Test circuit for switching times
PBSS304NX_2
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 -- 20 November 2009
9 of 15
NXP Semiconductors
PBSS304NX
60 V, 4.7 A NPN low VCEsat (BISS) transistor
9. Package outline
4.6 4.4 1.8 1.4
1.6 1.4
2.6 2.4
4.25 3.75 1.2 0.8 0.48 0.35 3 0.44 0.23 06-08-29
1 0.53 0.40 1.5 Dimensions in mm
2
3
Fig 15. Package outline SOT89 (SC-62/TO-243)
10. Packing information
Table 8. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number PBSS304NX
[1]
Package SOT89
Description 8 mm pitch, 12 mm tape and reel
Packing quantity 1000 -115 4000 -135
For further information and the availability of packing methods, see Section 15.
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PBSS304NX_2
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 -- 20 November 2009
10 of 15
NXP Semiconductors
PBSS304NX
60 V, 4.7 A NPN low VCEsat (BISS) transistor
11. Soldering
4.75 2.25 2.00 1.90 1.20 solder lands 0.85 0.20 solder resist occupied area 1.20 4.60 0.50 1.20 1.20 1.70 solder paste 4.85
Dimensions in mm
1.00 (3x)
3
2
1
msa442
0.60 (3x) 0.70 (3x) 3.70 3.95
SOT89 standard mounting conditions for reflow soldering
Fig 16. Reflow soldering footprint
6.60 2.40
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2
3.50
0.50 3 1 1.20 3.00
7.60
solder lands solder resist occupied area
Dimensions in mm
preferred transport direction during soldering 1.50
0.70 5.30
msa423
Not recommended for wave soldering
Fig 17. Wave soldering footprint
PBSS304NX_2
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 -- 20 November 2009
11 of 15
NXP Semiconductors
PBSS304NX
60 V, 4.7 A NPN low VCEsat (BISS) transistor
12. Mounting
32 mm 32 mm 30 mm
40 mm
2.5 mm 1 mm 3 mm 2.5 mm 1 mm 0.5 mm 5 mm 3.96 mm 1.6 mm
001aaa234
40 mm 2.5 mm 1 mm 0.5 mm
20 mm
5 mm 3.96 mm 1.6 mm
001aaa235
PCB thickness: FR4 PCB = 1.6 mm ceramic PCB = 0.635 mm
PCB thickness = 1.6 mm
Fig 18. FR4 PCB, standard footprint; ceramic PCB, Al2O3, standard footprint
Fig 19. FR4 PCB, mounting pad for collector 6 cm2
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PBSS304NX_2
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 -- 20 November 2009
12 of 15
NXP Semiconductors
PBSS304NX
60 V, 4.7 A NPN low VCEsat (BISS) transistor
13. Revision history
Table 9. Revision history Release date 20091120 Data sheet status Product data sheet Change notice Supersedes PBSS304NX_1 Document ID PBSS304NX_2 Modifications:
* * * *
This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content. Figure 15 "Package outline SOT89 (SC-62/TO-243)": updated Figure 16 "Reflow soldering footprint": updated Figure 17 "Wave soldering footprint": updated Product data sheet -
PBSS304NX_1
20060816
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PBSS304NX_2
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 -- 20 November 2009
13 of 15
NXP Semiconductors
PBSS304NX
60 V, 4.7 A NPN low VCEsat (BISS) transistor
14. Legal information
14.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
14.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control -- This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data -- The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.
14.3 Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such www..com information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental
14.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
15. Contact information
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
PBSS304NX_2
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 -- 20 November 2009
14 of 15
NXP Semiconductors
PBSS304NX
60 V, 4.7 A NPN low VCEsat (BISS) transistor
16. Contents
1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 13 14 14.1 14.2 14.3 14.4 15 16 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics . . . . . . . . . . . . . . . . . . 4 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 Packing information . . . . . . . . . . . . . . . . . . . . 10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Mounting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 14 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 14 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Contact information. . . . . . . . . . . . . . . . . . . . . 14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
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Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 20 November 2009 Document identifier: PBSS304NX_2

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